Semiconductor

Wet chemical metalizations have become important process steps in the semiconductor production. There are different plating processes in the front end (FEOL), in the backend (BEOL) and in the packaging field. The composition of plating bathes for electroless metal deposition is typical more complex as the one for electro chemical deposition (ECD).

We offer analytical and dosing systems for both electroless and galvanic deposition for the leading chemical suppliers.

With ancosys ancolyzer and ancodos

• one can ensure that the bath composition is always in the required range.