Plating processes for semiconductor

Plating bathes are predominantly complex multi component solutions. For each parameter and concentration a specific analysis method is developed and adapted to your process.

Process	Parameter
Galv. Copper	Copper, Sulfuric acid, Chloride, Organics
Tin/Lead	Tin, Lead, MSA, Organics
Tin/Silver	Tin, Silver, MSA, Organics statt Tin, Silver, MSA,Stabilizer
Galv. Nickel	Nickel, Boric acid, Chloride, Wetting agent, pH
Galv. Gold	Gold, Density, Grain finer, pH
E-less Nickel	Nickel, Reducer, pH, Stability
E-less Palladium	Pd, Reducing agent, Complexing agent, pH
E-less Gold	Au, Complexing agent, pH

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